SC2200UFH-266

Product Summary

The SC2200UFH-266 Thin Client On a Chip is a member of Geode SC2200, the National Semiconductor IA (Information Appliance) on a Chip family of fully integrated x86 system chips. The Geode SC2200 includes: (1)The Geode GX1 processor module combines advanced CPU performance with Intel MMX support, fully accelerated 2D graphics, a 64-bit synchronous DRAM (SDRAM) interface, a PCI bus controller, and a display controller; (2)A low-power CRT and TFT Video Processor module with a Video Input Port (VIP), and a hardware video accelerator for scaling, filtering, and color space conversion; (3)The Core Logic module includes: PC/AT functionality, a USB interface, an IDE interface, a PCI bus interface, an LPC bus interface, Advanced Configuration Power Interface (ACPI) version 1.0 compliant power management, and an audio codec interface; (4)The SuperI/O module has: three serial ports (UART1, UART2, and UART3 with fast infrared), a parallel port, two ACCESS.bus (ACB) interfaces, and a real-time clock (RTC).

Parametrics

Absolute maximum ratings: (1)TCASE, Operating case temperature: -45 to 110℃; (2)TSTORAGE, Storage temperature: -45 to 125℃; (3)VMAX, Voltage on 5V tolerant balls: -0.5 to 6.0 V; Others: -0.5 to 3.6 V; (4)IIK, Input clamp current: -0.5 to 10 mA; (5)IOK, Output clamp current: 25 mA.

Features

Features: (1)32-Bit x86 processor, up to 300 MHz, withMMX instruction set support; (2)Memory controller with 64-bit SDRAM interface 2D graphics accelerator; (3)CRT controller with hardware video accelerator; (4)CCIR-656 video input port with direct video for full screen display; (5)PC/AT functionality; (6)PCI bus controller; (7)IDE interface, two channels; (8)USB, three ports, OHCI (OpenHost Controller Interface) version 1.0 compliant; (9)Audio, AC97/AMC97 version 2.0 compliant; (10)Virtual System Architecture(VSA technology support; (11)Power management, ACPI (Advanced Configuration; (12)Power Interface) version 1.0 compliant Package: 432-Terminal EBGA (Enhanced Ball Grid Array); 481-Terminal TEPBGA (Thermally Enhanced Plastic Ball Grid Array).

Diagrams